STANDARD PRODUCTION:
MINIMUM HOLE 100 µ
MINIMUM TRACK 100 µ
MINIMUM ISOL. 100 µ
NUMBER OF LAYERS 20
BOARD THICKNESS 0.2÷5 mm
COPPER THICKNESS 17÷150 µ
MULTILAYER MAX BOARD 810x500 mm
PLUGGED VIAS (drill on pad)

TECNOLOGYCAL CARACTERISTICS:
MINIMUM HOLE 50 µ
MINIMUM TRACK 50 µ
MINIMUM ISOL. 50 µ
NUMBER OF LAYERS 30
BOARD THICKNESS 0.05÷6 mm
COPPER THICKNESS 5÷500 µ
MULTILAYER MAX BOARD 900x600 mm
PRESSFIT
BLIND AND BURIED VIAS
CONTROLLED IMPEDENCE

Download technological specification